You have data about defects in a circuit board. You want to examine the major factors and possible causes of the defects in a diagram.
1. Select Help > Sample Data Library and open Ishikawa.jmp.
2. Select Analyze > Quality and Process > Diagram.
3. Select Parent and click X, Parent.
4. Select Child and click Y, Child.
5. Click OK.
Figure 14.2 Ishikawa.jmp DiagramĀ
The major factors are Inspection, Solder process, Raw card, Components, and Component insertion. From each major factor, possible causes branch off, such as Inspection, Measurement, and Test coverage for the Inspection factor.
You can focus on one area at a time to further examine the possible causes or sources of variation for each major factor.