Use a diagram to examine the major factors and possible causes of the defects in a circuit board.
1. Select Help > Sample Data Folder and open Ishikawa.jmp.
2. Select Analyze > Quality and Process > Diagram.
3. Select Parent and click X, Parent.
4. Select Child and click Y, Child.
5. Click OK.
Figure 16.2 Ishikawa.jmp DiagramĀ
The major factors are Inspection, Solder process, Raw card, Components, and Component insertion. From each major factor, possible causes branch off, such as Inspection, Measurement, and Test coverage for the Inspection factor.
You can focus on one area at a time to further examine the possible causes or sources of variation for each major factor.